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HP, Intel, Microsoft, Nec, NXP and Texas Instruments are currently working on the conception of USB 3.0. Compatible with the previous USB version, the new one attempts to multiply the speed of USB 2.0 by a factor of 10. You may recall we currently attain 480 Mbits /s, so this will then be 4.8 Gbits /s. The final version of USB 3.0’s specifications should see the day in the first half of 2008. |
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In January 2006, Intel announced having produced the first SRAM chip engraved in 45nm which at the time added up to more than a billion transistors. While the first 45nm processors will soon arrive on the market, the Santa Clara giant has announced the successful engraving of SRAM chips in 32nm on a 300mm wafer. This time each chip contains slightly more than 1.9 billion transistors.
Intel says that it’s on schedule to introduce processors engraved in 32nm for 2009. You may recall this will be the Westmere, which will be a die-shrink of its Nehalem architecture available next year in 45nm. |
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Intel officially announced at the IDF that on November 12th it will launch its first processor based on the Penryn core. This will be the Core2 Extreme Edition QX9650 set at a «mere» 3 GHz, while Intel presented a demonstration of a 3.33 GHz version last April. The gains announced by Intel vary without SSE4 between 7 and 13% compared to a QX6850 at equivalent frequencies. The other versions of the Penryn are expected out in the beginning of 2008. |
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