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News of the day

  • AMD delivers its first Llanos
  • Intel launches the Xeon Sandy Bridges
  • AM3+ compatibility: MSI too
  • Intel Xeon E7 Westmere-EX: 10 cores!
  • AMD turns up the heat for 32nm
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     AMD delivers its first Llanos
      Posted on 04/04/2011 at 21:50 by Marc
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    AMD has announced on its blog that deliveries of its Llano APU have begun. In this photo we can see the AMD Singapore assembly team posing with what we hope isn’t the only box in this first delivery. The image’s EXIF informs us that it was taken on March 31st.


    To recap, Llano is engraved at 32nm by GlobalFoundries. This APU combines an Athlon II X4 CPU and a Cedar / Radeon HD 5450 GPU. It is around three months late. What about the official launch? Up until now AMD were talking about the summertime, but the AMD CFO says that OEM systems based on Llano should start coming onto the market in the course of the second quarter.



     Intel launches the Xeon Sandy Bridges
      Posted on 04/04/2011 at 14:54 by Guillaume
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    In addition to the Westmere-Exs, Intel has also made its first Xeons based on the Sandy Bridge architecture available before launch. These chips – which were officially to be launched later in the week – are in fact already on the Intel price list updated today.

    We were already aware of the broad lines of the range as Intel unveiled it a couple of weeks ago during an announcment on microservers. The list has however grown from seven to eleven models. To recap, these Xeon E3s use socket 1155 and have been designed for single socket servers.


    In comparison to the list that we published previously, the four new arrivals (E3-1275, E3-1245, E3-1235 and E3-1225) differ by having an HD Graphics controller. Their TDP is therefore up from 80 to 95 watts on the other models, whose specs they are otherwise identical to (E3-1270, E3-1240, E3-1230 et E3-1220). All rules must have an exception and the E3-1225 only has a cache of 6 MB rather than 8 MB for the 1220.



     AM3+ compatibility: MSI too
      Posted on 04/04/2011 at 14:00 by Guillaume
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    Following Asus, it’s over to MSI to publish a list of its AM3 motherboards that are compatible with forthcoming AMD AM3+ processors. Asus surprised us all when publishing their list as it had been stated that AM3+ processors wouldn’t be compatible with AM3 cards, as the sockets are seemingly incompatible (an additional pin as we demonstrated here). MSI has also confirmed that compatible BIOS’ will be included for some of its cards:


    The list published by MSI includes fourteen models. Note that while a good few chipsets have been included, as with Asus 890X motherboards are not. MSI says that the list will be updated as time goes by and other models can be added.



     Intel Xeon E7 Westmere-EX: 10 cores!
      Posted on 04/04/2011 at 11:50 by Marc
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    Intel has now launched the Xeon 2800s, 4800s and 8800s, designed for dual, quad and eight socket servers respectively. Using socket FCLGA8 like the Xeon 7500s, these CPUs are based on the Westmere-EX and are available in various versions:

    - 6 to 10 cores
    - 18 to 30 MB of L3 cache
    - 1.73 to 2.40 GHz
    - TDP of 95 to 130W
    - 4.80 to 6.40 GT/s for the QPI
    - 8 DDR3 channels


    Like all Westmeres, the 32nm versions of Nehalem, these CPUs support AES-NI instructions for encryption. So as to ensure good latency for the huge L3 cache, it is divided into ten and linked to the cores via a bi-directional ring and there are 8 channels of DDR3 memory managed by two controllers.

    Have we got you going? In terms of pricing, the Xeon E7-2803, a 6 core version / 18 MB of L3 / 1.73 GHz / 95w / 4.8 GT/s comes in at $774, but you’ll need to pay $4616 for the Xeon E7-8870 with the following impressive specs: 10 cores, 30 MB of L3, 2.4 GHz 130W / 6.4GT/s.



     AMD turns up the heat for 32nm
      Posted on 04/04/2011 at 11:25 by Marc
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    AMD has just announced that it has renegotiated its outsourcing agreement with GlobalFoundries. The new agreement fixes quarterly volumes of wafers for 2011 as well as payment conditions.


    For 45nm wafers, AMD will continue to pay a fixed price per wafer, but for the 32nm process, AMD will only pay for founctioning chips. As of 2012, the 32nm process will once again be paid for at a fixed price per wafer, based on production costs + GlobalFoundries’ commission. AMD will in addition pay a quarterly bonus to GloFlo in 2012 if production capacities attain certain objectives.

    With this new agreement, AMD is clearly putting pressure on GlobalFoundries when it comes to the 32nm engraving process, whether this be in terms of quality in 2011 or volumes for 2012.


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