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AMD organized a press conference to close the first day of the CeBIT. Besides the standard discourse, the manufacturer wanted to reassure us on its advances in the development of its 45 nm CPUs, and as we mentioned earlier, they conducted a demonstration of a quad core Shanghai (video encoding that didn’t entirely saturate the 4 cores).
 A Shanghai wafer.AMD also wanted to reassure us on the Puma, its future mobile platform mobile which should finally arrive this summer. You may recall, it will be based on a new CPU and the 780 G chipset in its mobile version of course.  A working laptop based on the Puma platform.However, what stood out the most in their presentation was AMD’s strong insistence on the graphics aspect, first with the 780 G, which adds a big improvement compared to previous solutions, and then with CrossFire X. The latter is now available via a new driver which you may recall enables combining 3 or 4 graphic cards.  While the manufacturer stressed this point, we noticed the usual "Customer Centric" slogan being replaced by the "Ultimate Visual Experience" on most slides, it’s not without reason. This is more or less the only domain that allows it to set itself apart from Intel whose integrated cores can be short-winded and which often rely on poorly evolved drivers. AMD thus uses the 780 G to aggressively point out the poor performances of Intel’s integrated graphic cores as well as the absence of DirectX 10 support and HD video acceleration. So while waiting for more performance competitive CPUs, it’s in graphics that AMD will try and fend off its rival. |
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AMD is taking advantage of the CeBIT to show journalists that the Shanghai and Deneb, the server and desktop versions of its next 45 nm quad core CPUs, are functional.
 These were produced in the Dresden Fab 36 on 300mm wafers. The manufacturer also used the event to stress the "performance per watt" ratio of its future processors and not simply performances, a sign that in the short term they will not be able to rival Intel on the very high end. Expected out in the second half of 2008, these CPUs will have an L2 cache of 512 KB per core, a shared L3 cache which can be as high as 6 MB and they will still fit into the Socket AM2+ and support DDR2. We will have to wait until 2009 to see AM3 versions which will support DDR3. |
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After the BigTyp 14 presented at the CES, Thermaltake is taking advantage of the CeBIT to launch a new CPU cooling system equipped with a 14cm fan. The V14 Pro thus borrows the design of theV1 launched a year ago but which had an 11cm fan. Based on the idea that bigger is better, this cooling system should offer interesting results.
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At the CeBIT, Corsair is presenting the fastest DDR3 memory on the market, more specifically, DDR3-2133 functioning in 8-8-8-24. These 1 GB modules should arrive between now and the end of this month for an unrevealed price. Here they were functioning on an NVIDIA platform and therefore with the nForce 790i as this chipset which will be launched in two weeks is the first nForce DDR3.
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MSI is taking advantage of the CeBit to launch the Hybrid Freezer, a technology devoted to the cooling of graphic cards starting with implementation on the GeForce 8800 GT 1 GB. The principle is relatively simple as up until 87°C the card functions in passive cooling mode. Once temperature surpasses this figure, the fan, announced as very discreet, comes into action. Here is an intermediate solution between passive and active that could be of interest.
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AMD has just officially announced two new IGPs: the 780G and 740G which now join the 790FX and 770.
The 780G mainly sets itself apart by its integrated graphic circuit baptized the Radeon HD 3200 which supports DirectX 10. In addition, it is the first AMD chipset compatible with Hybrid Graphics. Furthermore, it supports PCI-Express 2.0 and HyperTransport 3.0, enabling it to optimally function with the Phenom.
While waiting for our first tests, we were already able to carry out a few benchmarks. If the Radeon HD 3200 is apparently not enough for gaming, Hybrid Graphics, without being revolutionary, still enables the 780G - Radeon HD 3450 combo to surpass the GeForce 8500 GT in some cases.
 As for the 740G, it has a DirectX 9.0 graphic core, which however should offer higher performances than those of its predecessor, the 690G. This is nothing too dramatic because it’s not very likely that we will be able to play games with an IGP in DirectX 10 in the near future. For the Southbridge, without surprise we find the SB700 which is rather classic because it can support up to 6 SATA-II ports, RAID 0, 1 and 0+1, an IDE Ultra ATA/133 and 12 USB 2.0 ports Finally, count on spending around 85€ for a 780G motherboard and 65€ for a 740G in France. |
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The top screen of 2008 could be the T220P :
•22 inches •TN 2 ms •Contrast of 20000:1 •HDMI + DVI + VGA + YUV + TV tuner•A price announced barely higher than that of the current 226BW. The problem: Samsung added a lighted bar on the lower front part of the screen. Depending upon your taste, you can opt for a red model (should be the most widely available Europe), green or blue. The inconvenience is that this bar never goes out not even via manual controls! |
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