HKEPC has tested an Intel Shelton platform. This new and original platform’s target is to compete with the VIA C3 on the fanless computer market and basic products for emerging countries. The platform tested by HKEPC is build with an Intel motherboard D845GVSH, based on the i845GV chipset. On this chipset is soldered a Shelton 1 GHz processor (no socket).
According to the information send by CPU-Z, this processor is actually a derivate of a 90nm Pentium M Banias. The only difference is that this processor doesn’t have a second cache level, a first since the first Celeron in 1999. This processor is equipped with a passive and rather simple heatsink.
The Shelton provides clearly better performances
than the VIA C3 (but it was not that difficult). Performances improvements are between 30 to 70%. The VIA C3 1 GHz temperatures reach 32°C in stand by and 51°C in use with an active heatsink, instead of 34°c and 56°C for the Shelton with a passive heatsink. The Shelton will probably overshadowed the VIA, but there is still some unknown information and amongst them the price!