TSMC: ready for 40nm Posted on 26/03/2008 at 21:50 by Nicolas
The manufacturer TSMC known to the public thanks to its clients such as ATI, Nvidia and VIA has unveiled its 40nm Half-Node fabrication process .
Two versions will be offered: the 40G (general purpose) and 40LP (power-efficient low power). The first is destined to high performance circuits such as GPUs and CPUs while the second should be intended for chips that are sensitive to leaks such as those which equip Wireless models and mobile phones.
The Taiwanese company indicates that 40nm will enable multiplying the gate density by 2.35 compared to the 65nm process, lower the consumption by 15% compared to the 45nm and that they already have a dozen of interested clients. The first wafers are expected for the second quarter of this year. Finally, you may recall that the company is already working on 32nm and 22nm.
The manufacturer TSMC known to the public thanks to its clients such as ATI, Nvidia and VIA has unveiled its 40nm Half-Node fabrication process .