VIA releases the C7 Posted on 27/05/2005 at 12:36 by Marc
VIA has just announced the new C7 processor. Using IBM 90 nm process and including the SOI technology, this chip features a 30 mm² only die. The processor power consumption in stand by can get as low as 0.1W and maximum thermal dissipation is 12, 15 an 20 Watts for 1.5, 1.7 and 2.0 GHz. The architecture seems to be quite close to the VIA C3/Eden. The only difference is the cache L2 increase to 128 KB from 64 KB and the support of SSE2 and SSE3 instructions.
The security processor PadLock has also been improved. The VIA C7 is currently only released in a 21x21 mm NanoBGA packaging and uses the same type of bus than the Pentium 4 and Pentium M (here in FSB800).
