AMD is taking an interest in the Peltier effect Posted on 21/10/2004 at 20:13 by Marc
AMD has taken a patent last October 5 describing a semiconductor-on-insulator substrate incorporating a Peltier effect heat transfer device.
When DC voltage is applied to such a device, the positive and negative charge carriers in the pellet array absorb heat energy from the outside substrate surface and release it to the substrate inside…then heat energy on the surface inside need then be dissipated.
This device integration would improve the heat energy transfer from the semi-conductor to the insulator substrate. With reduced hottest areas, it will be possible to reach higher speed and increase the processor life.
Of course using the Peltier effect has a cost, because it only moves heat energy from A to B and creates additional heat energy. So it means that there will be more heat energy to dissipate and current research on micro channel integrated to the processor, nanotubes, or even technological process improvement and architecture optimisations will also have to be used with this technology.