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- 42nm DDR3 from Micron and Nanya
- Samsung also 1st on Flash NAND
- An anti-ghosting keyboard from Microsoft
- Samsung dominating the DRAM market
- 30nm DDR3 from Samsung
- CeBIT: USB 3.0 casings from Lian Li
- Kingston HyperX LoVo: 1.25v !
- 512 MB 40nm DDR3 from Samsung
- Corsair has announced a new case
- Buffalo presents a USB 3.0 hub



 CeBIT: USB 3.0 casings from Lian Li
  Posted on 05/03/2010 at 17:23 by Damien
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Casings manufacturers are starting to introduce USB 3.0, equipping casings with connectors that are compatible with the new standard that is starting to appear on motherboards. This is of limited interest as an additional chip is currently required and only supports 2 USB 3.0 connectors situated directly on the motherboard. We’ll have to wait for models with several controllers (one of which would be designed for external connectors) or a chipset natively supporting the standard for there to be any need for such connectors on a casing.

Given that Lian Li produces high-end models that users will, in principle, keep for some time, integration across new models now is a welcome move!


The PC-V352, a development of the PC-V351 that allows for a slightly larger power supply, is available in red, black and grey.



The PC-Q08, available in red or black, is slightly larger than the PC-Q07, with Lian Li trying to offer a ful compact range as soon as possible.



The PC-Q06, available in red and black, is halfway between a casing and a test array. You can fix an ATX format motherboard into it. What use is such a model, really?



The PC-X900, in red and black.



The Tyr X2000F, a development of the Tyr X2000 that doesn’t insultate the power supply from the rest of the casing any more, and of course supports USB 3.0.



ATX and micro-ATX format test arrays.



And lastly, the PC-T1, a micro-ATX casing / test array in an original format to say the least. Lian Li tells us that the final model is likely to be slightly different but that it will be put on sale.



 Kingston HyperX LoVo: 1.25v !
  Posted on 03/03/2010 at 11:07 by Marc
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Kingston has today announced 4 new low energy consumption 2x2 GB DDR3 kits, the HyperX "LoVo". They stand out for their power supply voltages, which go down to 1.35 or even 1.25v :

KHX1866C9D3LK2/4GX: DDR3-1866 CL9 1.35v / DDR3-1600 CL9 1.25v, €178
KHX1600C9D3LK2/4GX: DDR3-1600 9-9-9-27 at 1.35v, €139
KHX1600C9D3LK2/4GX: DDR3-1333 9-9-9-27 at 1.25v, €135


These memory modules have been designed for the Intel LGA1156 platform and come with XMP profiles. Kingston says that validation was carried out on an ASUS P7P55D Evo motherboard.



 512 MB 40nm DDR3 from Samsung
  Posted on 24/02/2010 at 15:23 by Benoit - source: Samsung
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After having announced its 256 MB 40nm chips last July, Samsung are the first to announce mass production of a 512 MB 40nm DDR3 chip. The density of these chips allow for the production of 16 GB DDR3 bars for desktop, 32 GB for servers and 8 GB for laptops. Running at 1.35v and 1.5v, they allow a 35% economy of energy in comparison to the old 50nm solutions according to Samsung.


The arrival of 40nm chips should signal a significant reduction in the cost of chips with 512 MB densities, which will eventually allow a reduction in the price of high capacity memory bars.



 Corsair has announced a new case
  Posted on 18/02/2010 at 11:59 by Benoit
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Corsair have announced a new casing, based on the Obsidian 800D: the Obsidian 700D.

The 700D takes on the exterior form of the 800D, made in aluminium with the same high-end finish. The hard drive bay has disappeared however, as has the transparent lateral door. Instead you find a black panel and more standard slots for the hard drives, which means you have to open the casing to gain access.

The dimensions (609 x 609 x 229 mm), the internal layout, the fan and the wiring system are all identical to the 800D. The 700D is positioned as a lite 800D, at a lower price but which hasn’t been detailed by Corsair. As the 800D is currently selling for around €290, you have to say that this is still pretty expensive for a casing.



 Buffalo presents a USB 3.0 hub
  Posted on 17/02/2010 at 15:29 by Benoit - source: Buffalo
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USB 3.0 is starting to spread its wings. It will need a bit more time to take over from USB 2.0 but the number of compatible products is growing fast.

For those who find having both ports on compatible motherboards a bit of a squeeze, Buffalo is offering the BSH4A03U3, a USB 3.0 hub that allows connection of four peripherals on one port.

It comes in black or white and diodes allow you to identify which ports are in activity. Buffalo haven’t given any information on the controller but it’s probable that the hub is based on the VIA VL810 that we mentioned last month.


Availability hasn’t yet been announced but it should cost around €65, which will no doubt be a bit steep for some.


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